Wafer Handling Load Locks

Standard Load Locks

Wafer Handling Load Locks

Standard Load Locks

Automated-Load-Lock-Systems
Automated-Load-Lock-Systems

FEATURES

  • Reliable and Safe

  • Ease of Operation

  • Accessibility

  • Safety Interlock

  • Wafer/ Cassette Sensors

  • Reduced System Footprint

  • Plug and Play Vacuum Transport System

  • High Throughput with Batch Processing

  • Compatible with High Vacuum Environments

  • Linear Motion Mechanism (RS-232, Ethernet, DeviceNet)

Customizable Options

  • SEMI Standard and Custom End Effectors

  • Motor Integration

  • Vertical Motion Mechanism- Z-lift

  • Horizontal Reach

  • Substrate Size

  • Plumbing: Vacuum/Gas

  • Slit Valves: SMC/VAT

  • Payload

Automation-Gears

Single Substrate Vacuum Transfer Systems

Hine’s Star Systems are automated load locks designed to eliminate the need to vent and evacuate the OEMs process chamber prior to every process cycle. Our Star Systems offer various levels of functionality and integration that meet technical and budgetary requirements of most OEM applications including Atomic Layer Deposition, Physical Vapor Deposition, Chemical Vapor Deposition, Metal and Oxide Etch, MR Head Deposition, MEMS, and compound semiconductor applications.

Brochure

Hine Automation - Vacuum Load Locks Brochure

† SEMI standard sizes available and custom end effectors available upon request.
‡ Measured as three standard deviations (3σ)
* End effector design may impact max payload capability
** Maximum reach measured from the edge of the slit valve
*** Vertical stroke is optional

SL-200/300/450 Available Configurations

(T) Telescoping

Offers telescoping drive rail with the ability to obtain standard reach requirements in a compact design.

(MW) Multi-Wafer

Offers the ability to process multiple wafers using a single drive rail unit.

(GB) Glove Box

Offers glove box mounting flange with easy access for operators and maintenance door.

(HL) High Load

Offers the ability to process higher loads than standard unit due to the robust drive rail. (Often used for carriers rather than wafers.)

PRODUCT SPECIFICATIONS

Feature

SL-200

SL-300

SL-450

Pressure

Leak Rate

≤ 1 x 10-3 Torr (with mechanical pump)

≤ 1 x 10-6 Torr (with high vacuum pump)

≤ 1 x 10-9 SCC He/Sec

Reach*

Standard Drive Chamber

Reach*

Extended Drive Chamber

305mm beyond 50mm thick slit valve



380mm beyond 60mm thick slit valve



410mm beyond 60mm thick slit valve

610mm beyond 60mm thick slit valve

Reach accuracy

Placement accuracy

± 0.12 mm

≤ ± 0.20mm @ Full Extension

Payload*        

Droop*

2.2Kg [5.0 Lbs.]

≤ 2.0mm (at full extension)

2.2 Kg [5.0 Lbs.]

≤ 2.0mm

(at full extension)

5.4 Kg [12.0 Lbs.]

≤ 3.0mm

(at full extension)

Z-travel

Z-accuracy   

Particle performance†


+20mm (measured at the bellows feedthrough)

±0.01mm (measured at the bellows feedthrough)

<0.1 particle adders/cm2/Pass for particles of <0.5μm and

<0.02 particle adders/cm2/Pass for particles of >1.0μm

SL-200/300/450 Physical Specifications

Feature

SL-200

SL-300

SL-450

Main Chamber

381mm x 340mm x 104mm

432mm x 440mm x 104mm

670mm x 622mm x 133mm

Drive Chamber


363mm x 122mm x 87mm

432mm x 122mm x 91mm

425mm x 184mm x 118mm

628mm x 184mm x 118mm (Extended**)

Lid Dimensions

368mm x 340mm x 35mm

418mm x 440mm x 35mm

650mm x 622mm x 36mm

Chamber Volume

~ 12 liters

~ 16 liters

~ 43 liters

~ 46 liters (Extended**)

Weight

~ 34 kilograms

~ 42 kilograms

~ 104 kilograms

~ 111 kilograms (Extended**)

Interface

200mm MESC (46mm x 236mm)

300mm MESC (50mm x 336mm)

450mm MESC (56mm x 496mm)

Designs and Manufactures Vacuum Atmospheric Automation Systems and Robotic Components

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