Single Substrate Vacuum Transfer Systems

Hine's Star Systems are automated load locks designed to eliminate the need to vent and evacuate the OEMs process chamber prior to every process cycle. Our Star Systems offers various levels of functionality and integration that meets technical and budgetary requirements of most OEM applications including Atomic Layer Deposition, Physical Vapor Deposition, Chemical Vapor Deposition, Metal and Oxide Etch, MR Head Deposition, MEMS, and compound semiconductor applications.



  • Handles wafer sizes up to 450mm
  • High vacuum compatibility
  • End effector for SEMI Standard and custom substrates
  • CE compliant



  • Vertical motion – Z lift
  • Vacuum and gas plumbing
  • Integrated transfer control module
  • Custom end effectors

† SEMI standard sizes available and custom end effectors available upon request.

‡ Measured as three standard deviations (3σ)

* End effector design may impact max payload capability

** Maximum reach measured from the edge of the slit valve

*** Vertical stroke is optional


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SL-200 SL-300 SL-450
Wafer Sizes ≤200mm† ≤300mm† ≤450mm†
Pay Load (Std/Hi Load) 1.5/5.0 kg*
Mounting Facet 200mm MESC 300mm MESC 450mm MESC
Axes of Motion R, Z
Vacuum performance
Base operating pressure
Leak Rate
<5.00E-07 Torr
1.00E-09 scc He/sec
Input Power 24 VDC 2.0 Amps
Maximum Temperature 100⁰C
Exposed Materials 6061-T6 Aluminum, Stainless Steel 300
and 400 Series, Viton,
Borosilicate Glass, Crytox, Delrin, PEEK
Control Interface RS-232 / Ethernet
MCBF >3.00E+05
CE Compliant
Max. Reach 305mm** 355mm** 635mm**
Vertical Stroke 0.5°***

Moving Your Technology

12495 34th St. North, Suite B, St. Petersburg, FL 33716


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