Vacuum Load Lock Chambers

Single Substrate Vacuum Transfer Systems

Vacuum Load Lock Chambers

Single Substrate Vacuum Transfer Systems

FEATURES

Handles wafer sizes up to 450mm
High vacuum compatibility
End effector for SEMI Standard and custom substrates
CE compliant

OPTIONS

Vertical motion – Z lift
Vacuum and gas plumbing
Integrated transfer control module
Custom end effectors

Single Substrate Vacuum Transfer Systems

Hine’s Star Systems are automated load locks designed to eliminate the need to vent and evacuate the OEMs process chamber prior to every process cycle. Our Star Systems offers various levels of functionality and integration that meets technical and budgetary requirements of most OEM applications including Atomic Layer Deposition, Physical Vapor Deposition, Chemical Vapor Deposition, Metal and Oxide Etch, MR Head Deposition, MEMS, and compound semiconductor applications.

Brochure

† SEMI standard sizes available and custom end effectors available upon request.
‡ Measured as three standard deviations (3σ)
* End effector design may impact max payload capability
** Maximum reach measured from the edge of the slit valve
*** Vertical stroke is optional

PRODUCT SPECIFICATIONS

	SL-200	SL-300	SL-450
Wafer Sizes	≤200mm†	≤300mm†	≤450mm†
Pay Load (Std/Hi Load)		1.5/5.0 kg*
Mounting Facet	200mm MESC	300mm MESC	450mm MESC
Axes of Motion		R, Z
Vacuum performance Base operating pressure Leak Rate		<5.00E-07 Torr 1.00E-09 scc He/sec
Input Power		24 VDC 2.0 Amps
Maximum Temperature		100⁰C
Exposed Materials		6061-T6 Aluminum, Stainless Steel 300 and 400 Series, Viton, Borosilicate Glass, Crytox, Delrin, PEEK
Control Interface		RS-232 / Ethernet
MCBF		>3.00E+05
CE		Compliant
Repeatability R Z		0.15mm‡ 0.10mm‡
Max. Reach	305mm**	355mm**	635mm**
Vertical Stroke		0.5°***